High-reliability build-up wiring board
High board thickness specifications, low dielectric material specifications, stack via specifications, etc.! We can accommodate various specifications.
We offer build-up wiring boards that support high density and high reliability. We can accommodate various specifications, including 0.4mm pitch, high board thickness, low dielectric material, stacked via specifications, and large interlayer thickness (100-120um). We deliver printed circuit boards with specific functions added for each application, from pattern design to manufacturing in a consistent system. Please feel free to consult us when you need assistance. *For more details, please refer to the PDF materials or feel free to contact us.
- Company：沖電気工業 産業営業本部 産業営業統括室
- Price：Other
